| 一种通用低成本大功率高亮度LED封装技术 |
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| 引用本文： | 唐政维,关鸣,李秋俊,董会宁,蔡雪梅. 一种通用低成本大功率高亮度LED封装技术[J]. 微电子学, 2007, 37(3): 354-357,363 |
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| 作者姓名： | 唐政维 关鸣 李秋俊 董会宁 蔡雪梅 |
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| 作者单位： | 重庆邮电大学,光纤通信技术重点实验室,重庆邮电大学,光电学院,重庆,400065 |
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| 摘 要： | 提出了一种热传导高、热膨胀匹配良好、低成本、大功率、高亮度LED封装技术。该技术采用光电子与微电子技术相结合，利用背面出光的LED芯片，倒装焊接在有双向浪涌和静电保护电路的硅基板上。由于在封装中引入了热膨胀过渡层，在保证良好热膨胀匹配的同时，热阻增加少。采用该封装技术封装的白光LED，发光稳定，光衰小，长期寿命高。
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| 关 键 词： | 大功率LED 白光LED LED封装 热膨胀匹配 热阻 |
| 文章编号： | 1004-3365（2007）03-0354-04 |
| 修稿时间： | 2006-12-042007-03-15 |
Packaging Technology for Low-Cost and High-Power/High-Brightness LED''''s |
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| TANG Zheng-wei,GUAN Ming,LI Qiu-jun,DONG Hui-ning,CAI Xue-mei. Packaging Technology for Low-Cost and High-Power/High-Brightness LED''''s[J]. Microelectronics, 2007, 37(3): 354-357,363 |
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| Authors: | TANG Zheng-wei GUAN Ming LI Qiu-jun DONG Hui-ning CAI Xue-mei |
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| Affiliation: | School of Optoelectronics , Chongqing University of Posts and Telecommunications, Chongqing 400065 , P. R. China |
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| Abstract: | A packaging technology for low cost,high-power and high-brightness LED's with high heat-conductance and well-matched thermal expansion is proposed,in which LED chips reflecting light from back side are soldered onto a silicon substrate with bidirectional surge and static protection circuit by combining photoelectronics with microelectronics technology.A thermal expansion filtering transition layer is introduced in the package,which reduces the heat resistance while ensuring good match of thermal expansion.White-light LED's packaged in this technology have stable luminescence,small attenuation and extended lifetime. |
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| Keywords: | High power LED White-light-LED LED packaging Thermal expansion matching Heat resistance |
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