含侧环氧基硅油复合改性环氧树脂的研究

采用侧基环氧化硅油(ES)及其改性物(PSA)来复合改性双酚A型环氧树脂(EP).通过测定复合改性固化物的冲击强度、拉伸强度、断裂伸长率和玻璃化转变温度(Tg),扫描电子显微镜对改性固化物的断裂面形态分析等,系统探讨了复合改性方法、有机硅组成及其含量等对复合改性材料性能的影响.结果表明,采用ES和PSA复合改性EP后,其韧性和耐热性均有不同程度的提高,且以环氧值高的ES和PSA的改性效果更好.其中环氧树脂经10份ES-16或10份PSA-16改性后,Tg由未改性的156.73℃提高到177.35℃,比改性前提高了近20.62℃,均达到了很好的增韧和提高耐热性的效果,符合电子封装等高性能材料的改性要求.

Compound modification on epoxy resins by side epoxy group polysiloxane

Compound modification on bisphenol A epoxy resin(EP) was conducted by side chain epoxy group polysiloxane(ES) and its modifying agent(PSA). The impact strength, tensile strength, elongation at break and glass transition termpereture(Tg) of the compound modified systems were investigated. And the morphology of fracture surfaces was observed by SEM. The results show that, the systems containing m(EP):m(ES-01)=100:10, or m(EP):m(PSA-01)=100:10 are found possessing improved toughness and thermal resistance of the cured materials, which accords with the modifying desire of structural adhesive and electronic encapsulation materials. At the same time, the thermal resistance of the latter is improved to be more remarkable, and its Tg reaches 177.35 ℃, which is higher than that of unmodified EP with 20.62 ℃.