CAD-oriented equivalent-circuit modeling of on-chip interconnectson lossy silicon substrate |
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Authors: | Ji Zheng Yeon-Chang Hahm Tripathi VK Weisshaar A |
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Affiliation: | Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR; |
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Abstract: | A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects on an Si-SiO2 substrate is presented. The modeling technique uses a modified quasi-static spectral domain electromagnetic analysis which takes into account the skin effect in the semiconducting substrate. Equivalent-circuit models with only ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE compatible equivalent-circuit models is shown to be in good agreement with the frequency-dependent transmission line characteristics of single and general coupled on-chip interconnects |
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