Topology optimization of a PCB substrate considering mechanical constraints and heat conductivity |
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Authors: | Min Sue Kim Sang Rak Kim Seog Young Han Byung Ju Yi |
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Affiliation: | (1) School of Civil, Environmental and Chemical Engineering, RMIT University, GPO Box 2476V, Melbourne, 3001, Australia |
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Abstract: | A material mixing method was suggested to obtain an optimal topology for a multiple material structure with multiple thermal
criteria, based on Evolutionary Structural Optimization (ESO). To examine the validity of the method, it was applied to a
printed circuit board (PCB) substrate. The overall efficiency of material usage in a PCB substrate was measured in terms of
the combination of thermal stress and heat flux density by using a combination strategy with weighting factors. A Pareto optimal
topology solution having multiple thermal criteria was obtained. The effects of weighting factors for multiple thermal criteria
as well as mechanical boundary conditions on optimal topologies were investigated. It was found that as the weighting factor
for heat flux density becomes larger, the sizes of holes at the center portion become larger in order to dissipate thermal
energy much more efficiently. It was also found that as the magnitudes of the heat conduction are getting larger, a similar
tendency of the optimal topologies is obtained to the above. The thermal stress on the clamped four sides is larger than that
on the two sides clamped. It is verified that the suggested material mixing method works very well for topology optimization
of a PCB substrate for various mechanical boundary conditions with multiple thermal criteria. |
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