| 无卤阻燃剂在印制电路板中的应用进展 |
| |
| 引用本文： | 马丽丽,包生祥,Bhanu Sood,Michael Pecht.无卤阻燃剂在印制电路板中的应用进展[J].材料导报,2010,24(23). |
| |
| 作者姓名： | 马丽丽 包生祥 Bhanu Sood Michael Pecht |
| |
| 作者单位： | 电子科技大学电子薄膜与集成器件国家重点实验室,中国四川成都,610054;马里兰大学高级寿命循环工程中心,美国,马里兰州,College Park 20742 |
| |
| 摘 要： | 介绍了无卤阻燃剂标准,含卤阻燃剂的使用现状、各国禁卤法规以及各大公司无卤印制电路板(PCB)转换进程;详细分析了PCB中阻燃剂种类及其作用机理,并总结出阻燃剂主要通过切断燃烧三要素来源达到阻燃目的;最后综述了无卤PCB开发现状及其失效和可靠性分析现状。由于新型电子产品对PCB的性能要求愈来愈高,同时又要满足无卤无铅的环保要求,单一阻燃剂很难达到要求,因此多种阻燃剂的协同作用是目前研究的热点方向之一。目前对于使用无卤基板材料后电子产品失效及可靠性方面的参考资料较少,也是需要进一步研究的方向之一。
|
| 关 键 词： | 无卤 阻燃剂 印制电路板 法规 可靠性 |
Advances in Halogen-free Flame Retardants of Printed Circuit Boards |
| |
| MA Lili,BAO Shengxiang,Bhanu Sood,Michael Pecht.Advances in Halogen-free Flame Retardants of Printed Circuit Boards[J].Materials Review,2010,24(23). |
| |
| Authors: | MA Lili BAO Shengxiang Bhanu Sood Michael Pecht |
| |
| Affiliation: | MA Lili1,BAO Shengxiang1,Bhanu Sood2,Michael Pecht2(1 State Key Laboratory of Electronic Thin Films , Integrated Devices,University of Electronic Science , Technology of China(UESTC),Chengdu,Sichuan 610054,2 Center for Advanced Life Cycle Engineering(CALCE),University of Maryl,,College Park,MD 20742) |
| |
| Abstract: | The standard of halogen-free,the current situation of halogenated flame retardant and the related legislation are introduced.The types of flame retardant applied in PCBs and its mechanism are discussed.Fire is the result of three ingredients: heat,fuel and oxygen.Flame retardants inhibit or suppress the combustion process by cutting off those three ingredients.At last,the status of halogen-free PCB materials and the advances of failure analysis and reliability in halogen-free PCBs are presented.As the devel... |
| |
| Keywords: | halogen-free flame retardant printed circuit board legislation reliability |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
