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化学镀锡工艺条件的优化
引用本文:王军丽,徐瑞东,郭忠诚,龙晋明.化学镀锡工艺条件的优化[J].电镀与环保,2002,22(5):13-16.
作者姓名:王军丽  徐瑞东  郭忠诚  龙晋明
作者单位:昆明理工大学,材料表面精饰与改性研究所,昆明,650093
摘    要:通过对化学镀锡液组成的调试和完善,研究了新的工艺配方中工艺条件对沉积速度和镀层中锡含量的影响,优化了化学镀锡的最佳工艺,此外,试验结果表明:次亚磷酸钠地反应动力学有积极的促进作用,能明显提高锡的化学沉积速度;镀液中没有络合剂时,化学反应不能进行;添加剂B和添加剂C均能细化晶粒,但沉积速度却随其浓度的增加而降低。

关 键 词:化学镀  优化  镀锡  沉积速度  工艺条件
文章编号:1000-4742(2002)05-0013-03
修稿时间:2002年2月26日

Optimization of the Process Conditions of Electroless Tin Plating
WANG Jun li,XU Rui dong,GUO Zhong cheng,LONG Jin ming.Optimization of the Process Conditions of Electroless Tin Plating[J].Electroplating & Pollution Control,2002,22(5):13-16.
Authors:WANG Jun li  XU Rui dong  GUO Zhong cheng  LONG Jin ming
Abstract:The effects of process conditions on deposition rate and tin content of the coatings are studied by adjusting and improving the bath compositions so that the process conditions of electroless tin plating are optimized. The experimental results also show that NaH 2PO 2 in the bath has a positive role in promoting reaction dynamics, and can greatly enhance the deposition rate of electroless tin; the chemical reaction cannot occur without complexing agent in bath. Both additive B and C can make crystals finer, but the deposition rate will decrease with the increasing of their concentrations.
Keywords:Electroless tin plating  Deposition rate  Process condition
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