| CCGA焊点热疲劳寿命统计分析与评价优化 |
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| 引用本文： | 黄春跃,周德俭,吴兆华.CCGA焊点热疲劳寿命统计分析与评价优化[J].桂林电子科技大学学报,2002,22(3):31-35. |
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| 作者姓名： | 黄春跃 周德俭 吴兆华 |
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| 作者单位： | 桂林电子工业学院,机电与交通工程系,广西,桂林,541004 |
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| 摘 要： | 通过对 CCGA焊点形态参数与热疲劳寿命进行正交回归分析 ,得出了 CCGA焊点形态主要参数与热疲劳寿命之间的关系表达式。利用得到的焊点形态参数与热疲劳寿命的关系表达式 ,采用优化程序对基于焊点热可靠性的焊点形态进行了评价优化 ,得到了优化后的焊点形态参数。
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| 关 键 词： | 焊点形态 CCGA 热疲劳寿命 统计分析 评价优化 |
| 文章编号： | 1001-7437(2002)03-31-05 |
| 修稿时间： | 2002年4月27日 |
The Statistical Analysis and Optimal Evaluating on Thermal Fatigue Life of CCGA Based on Solder Joint Shapes |
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| HUANG Chun-yue,ZHOU De-jian,WU Zhao-hua.The Statistical Analysis and Optimal Evaluating on Thermal Fatigue Life of CCGA Based on Solder Joint Shapes[J].Journal of Guilin Institute of Electronic Technology,2002,22(3):31-35. |
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| Authors: | HUANG Chun-yue ZHOU De-jian WU Zhao-hua |
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| Abstract: | The regression relations between the primary solder joints shape parameters and thermal fatigue life of CCGA are derived through orthogonal experiments and regressions analysis. By applying the relation between the solder joints shape parameters and thermal fatigue life,and based on the solder joint reliability,the optimization software is used in the optimal evaluating of the solder joint shapes.Consequently,the optimal solder joint shape parameters are gained. |
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| Keywords: | solder joint shapes CCGA thermal fatigue life statistical analysis optimal evaluation |
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