Deposition and characterization of a novel integrated ZnO nanorods/thin film structure |
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| Affiliation: | 1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC;2. Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan, ROC;1. Department of Electronic Information Materials, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China;2. Key Laboratory of Modern Metallurgy and Materials Processing, School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China;1. Department of Engineering Sciences, The Ångström Laboratory, Uppsala University, P.O. Box 534, SE-75121 Uppsala, Sweden;2. Department of Physics, Mustafa Kemal University, TR-31034 Antakya/Hatay, Turkey;3. ChromoGenics AB, Märstagatan 4, SE-75323 Uppsala, Sweden;1. Jiangsu Key Laboratory of Green Synthetic Chemistry for Functional Materials, School of Chemistry and Chemical Engineering, Jiangsu Normal University, Xuzhou, Jiangsu 221116, PR China;2. Center for Materials Chemistry, Xi''An Jiaotong University, PR China |
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| Abstract: | One-dimensional (1-D) ZnO (zinc oxide) nanostructures have received a lot of attention due to their superior properties. Various techniques have been developed to synthesize ZnO nanorods at high-temperature process using vapor–liquid–solid (VLS) mechanism. In this paper, we report a novel process to synthesize integrated ZnO nanorods/thin film structures using an RF magnetron sputter deposition under different deposition parameters and substrate conditions. The substrate used was glass plated with electroless Cu prepared using various conditions. The resulting specimens are analyzed using scanning electron microscopy (SEM), transmission electron microscopy (TEM), and X-ray diffraction (XRD). The effect of the copper surface roughness was found to be significant. ZnO nanorods were found only when the copper layer is rough enough. The roughness of the copper in general increases with the plating time and/or the ratio of VHCHO/VCu used in the plating bath. Post-plating annealing of the copper was also found to increase the surface roughness of the copper. |
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