| 选择性螯合滴定法测定酸铜镀液中的CuSO4 |
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| 引用本文： | 卢燕. 选择性螯合滴定法测定酸铜镀液中的CuSO4[J]. 电镀与涂饰, 1995, 14(1): 13-15 |
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| 作者姓名： | 卢燕 |
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| 作者单位： | 广东华丽电镀工业公司 |
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| 摘 要： | 本文提出一种测定ＣｕＳＯ４含量的螯合滴定方法。该方法是在酸铜镀液中，加入过量的ＥＤＴＡ络合全部的金属离子，再用硫脲、抗坏血酸和１，１０－二氮杂菲选择性地分解Ｃｕ－ＥＤＴＡ．该方法有效地消除了镀液中Ｆｅ＾３＋、Ｚｎ＾２＋、Ａｌ＾３＋等杂质金属离子对测定结果的干扰。方法简便，结果准确，已被成功用于镀铜生产中ＣｕＳＯ４的测定。
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| 关 键 词： | 镀铜 螯合滴定 硫酸铜 镀液 电镀 |
Selective Chelatometric Determination of CuSO_4 in Copper Plating Solution |
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| LU Yan. Selective Chelatometric Determination of CuSO_4 in Copper Plating Solution[J]. Electroplating & Finishing, 1995, 14(1): 13-15 |
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| Authors: | LU Yan |
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| Abstract: | A simple chelatometric method for determination of Cu2+ is presented. The process is based on initial complexation of Cu2+ Fe3+ Zn2+ Al3+ and other metal ions in solution with excessive amount of EDTA and subsequent decomposition of Cu-EDTA with thiourea, ascorbic acid, O-phenanthroline. The method has been successively used for determination of Cu2+ in copper sulfate plating bath. |
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| Keywords: | chemical analysis copper plating chelatometry selective copper sulfate |
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