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基于酚醛树脂的超高比表面积中孔活性炭的研究
引用本文:王进福,顾金玲,韩喜江,王彦昕. 基于酚醛树脂的超高比表面积中孔活性炭的研究[J]. 炭素, 2008, 0(3): 20-23
作者姓名:王进福  顾金玲  韩喜江  王彦昕
作者单位:哈尔滨工业大学,应用化学系,哈尔滨,150001
摘    要:以酚醛树指为原料,氢氧化钾为活化剂,制备酚醛树脂基超高比表面积活性炭。采用正交实验考查了制备工艺中炭化温度,碱炭比,活化温度和活化时间对活性炭吸附性能的影响,确定了超高比表面积活性炭的制备最佳工艺。利用TG—DTA对热解过程中树脂的炭化活化行为进行了探讨;通过N2-BET对活性炭比表面积和孔结构进行了表征,并简单分析了成孔机理。结果表明:炭化温度400℃,碱炭比为5:1,活化温度为750℃,活化时间为100min时,制备的酚醛树脂基活性炭比表面积为3013m^2·g^-1,孔容1.609ml/g,平均孔径2.135nm,亚甲基蓝吸附值为592mg·g^-1。

关 键 词:酚醛树脂  活性炭  活化  超高比袁面积

THE STUDY OF PHENOLIC RESIN-BASED MESOPORE ACTIVATED CARBON WITH SUPERHIGH SPECIFIC SURFACE AREA
Wang Jin-fu,Gu Jin-ling,Han Xi-jiang,Wang Yan-xin. THE STUDY OF PHENOLIC RESIN-BASED MESOPORE ACTIVATED CARBON WITH SUPERHIGH SPECIFIC SURFACE AREA[J]. Carbon(China), 2008, 0(3): 20-23
Authors:Wang Jin-fu  Gu Jin-ling  Han Xi-jiang  Wang Yan-xin
Affiliation:(Department of Applied Chemistry, Harbin Institute of Technology, Harbin, 150001 ,China)
Abstract:Phenolic resin--based activated carbon were prepared from Phenolic resin with potassium hydroxide as activating agent. The effect of carbonization temperature,the ratio of KOH to carbon,activation temperature and activation time on adsorption propertied of activated carbon were systematically studied by orthogonal expriments,and the optimum condition of the preparation of activated carbon with superhigh specific surface area was confirmed. The behavior of carbonization activation was discussed on the TG DTA analyses. Specific surface area and the porous strucres of activated carbon was analysed, by N2-BET,and The mechanism of pore formation was explained simply. The results show that when carbonization temperature at 400℃ ,5 : 1 of ratio of KOH to carbon,activation temperature at 750℃ ,activation time for 100rain,phenolic resin--based activatied carbon with 3 013m^2 · g^-1 of specific surface area, 1. 609cm^3 · g^-1 of pore volume,2. 135nm of average pore size and 592mg · g^-1 of methylene blue adsorption value could be prepared.
Keywords:phenolic resin  activated carbon  activation  superhigh specific surface area
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