| 导体性薄膜制造工艺 |
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| 引用本文： | 蔡积庆. 导体性薄膜制造工艺[J]. 印制电路信息, 2005, 0(4): 44-47 |
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| 作者姓名： | 蔡积庆 |
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| 摘 要： | 概述了导电性薄膜制造工艺,适用于制造挠性覆铜板、挠性印制板和电磁干扰(EMI)屏蔽滤波器等用途的导电性薄膜。
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| 关 键 词： | 导电性薄膜 挠性覆铜板 挠性印制板 金属乙炔化合物 |
Conductive Film Manufacturing Process |
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| Cai Jiqing. Conductive Film Manufacturing Process[J]. Printed Circuit Information, 2005, 0(4): 44-47 |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper summarizes the conductive film manufacturing process. It is suitable to manufacturing flexible copper-clad laminate(FCL),flexible printed circuit board (FPC) and electromagnetic interference (EMI) shield filter etc.industry application. |
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| Keywords: | conductive film flexible copper-clad lamiate flexible printed circuit board metal acetylide |
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