Bonding phenomena of transient liquid phase bonded joints of a Ni base single crystal superalloy

The bonding phenomena of Ni base single crystal superalloy CMSX-2 during transient liquid phase (TLP) bonding have been investigated using MBF-80 and F-24 insert metals. TLP bonding of the superalloy was carried out at 1373-1548K for 0-19.6ks in vacuum and the (100) plane of each test specimen was always aligned perpendicular to the joint interface. The dissolution width increased when the bonding temperature and holding time increased. The eutectic width decreased linearly with the square root of holding time during isothermal solidification. After homogenization treatment, the microstructure, distributions of hardness and alloying elements in the bonded interlayer become similar to those of the base metal.