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| 电沉积工艺参数对铜箔性能的影响 | |
| 引用本文： | 蔡芬敏,彭文屹,易光斌,何田,杨湘杰,黄永发,袁智斌,王平.电沉积工艺参数对铜箔性能的影响[J].南昌大学学报(工科版),2011,33(1):26-29,85. |
| 作者姓名： | 蔡芬敏 彭文屹 易光斌 何田 杨湘杰 黄永发 袁智斌 王平 |
| 作者单位： | 1. 南昌大学 材料科学与工程学院,江西南昌,330031 2. 南昌大学,机电工程学院,江西南昌330031 3. 江西耶兹铜箔有限公司,江西南昌,330096 |
| 基金项目： | 教育部科学技术研究重点基金资助项目，科技部科技人员服务企业行动基金资助项目 |
| 摘 要： | 分别在不同的电流密度、铜离子浓度、聚乙二醇（PEG）添加剂3种工艺参数下,电沉积制备铜箔试样。利用扫描电镜（SEM）、电子万能试验机和高温拉伸机,分析各种电沉积参数对铜箔显微组织和性能的影响。实验结果表明：铜箔的力学性能主要取决于其组织结构;电流密度、铜离子浓度以及添加剂PEG是影响铜箔的力学性能关键因素,三者对铜箔性能的作用机理相似,都是通过改变阴极极化来影响铜箔的电结晶过程,最终导致铜箔显微组织的变化。 |
| 关 键 词： | 铜箔 电流密度 铜离子浓度 聚乙二醇 |
Influence of Electro-Deposition Parameters on Mechanical Properties of Copper Foils |
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| CAI Fen-min,PENG Wen-yi,YI Guang-bin,HE Tian,YANG Xiang-jie,HUANG Yong-fa,YUAN Zhi-bin,WANG Ping.Influence of Electro-Deposition Parameters on Mechanical Properties of Copper Foils[J].Journal of Nanchang University(Engineering & Technology Edition),2011,33(1):26-29,85. | |
| Authors: | CAI Fen-min PENG Wen-yi YI Guang-bin HE Tian YANG Xiang-jie HUANG Yong-fa YUAN Zhi-bin WANG Ping |
| Affiliation: | CAI Fen-min1a,PENG Wen-yi1a,YI Guang-bin1b,HE Tian1a,YANG Xiang-jie1b,HUANG Yong-fa2,YUAN Zhi-bin2,WANG Ping2 (1a.School of Materials Science and Engineering,1b.School of Mechanical and Electrical Engineering,Nanchang University,Nanchang 330031,China,2.Jiangxi Copper-Yates Foil INC.,Nanchang 330096,China) |
| Abstract: | The copper foil samples were prepared in different current density,Cu2+ concentration and polyethylene glycol(PEG) respectively.The effects of electro-deposition parameters on the mechanical properties and microstructure of copper foils were studied by using scanning electron microscope,electronic universal testing machine and temperature tensile machine.The results showed that mechanical properties of copper foil were mainly determined by its microstructure,and current density,Cu2+ concentration and PEG we... |
| Keywords: | copper foil current density Cu2 concentration polyethylene glycol |
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