EFFECT OF RESIDUAL STRESS ON THE MARTENSITIC TRANSFORMATION OF SPUTTER-DEPOSITED SMA THIN FILMS |
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基金项目: | This work was supported by the Doctoral Research Foundation(No.98024838) of National Education Ministry. |
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摘 要: | TiNi thin films were sputter-deposited on circular single-cry stal silicon substrates un-der various sputtering parameters. The crystal structure and residual stress of the as-deposited films were determined by X-ray diffraction and substrate-curvature method. The phenomenon of stress-suppressed martensitic transformation was observed. R is considered that the residual stresses in SMA thin films based on circular substrates act as balanced biaxial tensile stresses. The status of equilibrant delays the align-ment of self-accommodated variants and the volume shrinkage during the martensitic transformation.
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EFFECT OF RESIDUAL STRESS ON THE MARTENSITIC TRANSFORMATION OF SPUTTER-DEPOSITED SMA THIN FILMS |
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Authors: | LWang DXu BCCai |
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Affiliation: | Information Storage Research Center, Shanghai Jiao Tong University, Shanghai 200030, China |
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Abstract: | TiNi thin films were sputter-deposited on circular single-crystal silicon substrates un-der various sputtering parameters. The crystal structure and residual stress of the as-deposited films were determined by X-ray diffraction and substrate-curvature method. The phenomenon of stress-suppressed martensitic transformation was observed. R is considered that the residual stresses in SMA thin films based on circular substrates act as balanced biaxial tensile stresses. The status of equilibrant delays the align-ment of self-accommodated variants and the volume shrinkage during the martensitic transformation. |
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Keywords: | martensitic transformation residual stress TiNi thin film shape memory alloy |
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