The anodic behaviour of copper in static and flowing hydrochloric acid solutions

The dissolution of copper in 0·36 to 3·6 HCl was studied both in static and in flowing solutions using flow rates between 0·098 and 1·14 ms⁻¹, all in the region of laminar flow.Steady state anode potential current curves, potentiodynamic sweep and potentiostatic pulse techniques and impedance measurements, in the range of 0·02–7 kHz, were used. In both static and flowing solutions dissolution of copper occurs to a monovalent state, as chloro-complexes CuCl⁻₂ and CuCl²⁻ with exchange currents for the two reactions of 1·9 × 10⁻⁵ A mm⁻² and 8 × 10⁻⁷ Amm⁻² respectively in 1·44 MHCl. The cuprous chloride layer first forms a monolayer and subsequently grows to considerable thicknesses. The double layer capacity is constant at 0·17 ± 0·03 μFmm⁻² at potentials below multilayer formation and this is interpreted as implying that there is no specific adsorption of chloride ions prior to formation of the cuprous chloride layer. As the flow rate increases the film becomes thinner so delaying the formation of the film of critical thickness required for passivation.