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酸性化学镀Ni-P合金
引用本文:陈立佳,李德高,邵桂春,赵忠俭. 酸性化学镀Ni-P合金[J]. 沈阳工业大学学报, 1996, 0(2)
作者姓名:陈立佳  李德高  邵桂春  赵忠俭
作者单位:Dept. of Meal Mated Engineering,SPU
摘    要:介绍了一种稳定性高、沉积速度较快的酸性化学镀Ni-P合金工艺.讨论了镀液组成及工艺条件对镀层沉积速度的影响,提出了化学镀Ni-P合金的最佳镀液组成和工艺条件.

关 键 词:化学镀;镍基合金

Electroless Ni-P Alloy Plating in Acidic Solution
Chen Lijia, Li Degao, Shao GUichun, Zhao Zhongjian. Electroless Ni-P Alloy Plating in Acidic Solution[J]. Journal of Shenyang University of Technology, 1996, 0(2)
Authors:Chen Lijia   Li Degao   Shao GUichun   Zhao Zhongjian
Abstract:A teChnique of electroless Ni-P alloy plating in acidic solution is intruduced, which is characterized by excellent stability of the plating solution and higher deposition rate. The effects of the composition of the plating salution and teChnological parameters on the deposition rate are discussed. In addition, the optimum solution composition and teChnological conditions are put forward.
Keywords:chemical plating  Nickel-base alloys
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