用树枝状多(胺-酰胺)作环氧树脂固化剂的研究

由丙烯酸甲酯和乙二胺(EDA)进行Michael加成反应,合成了外围带有多个活泼氢原子的树枝状多(胺-酰胺)(PAMAM1.0)。用其作环氧树脂固化剂,在理论添加量、不含稀释剂、20℃时,体系适用期和凝胶时间分别是EDA/环氧树脂体系的6.0倍和2.4倍,而在95,20和150℃固化时,固化速度分别是EDA/环氧树脂体系的1.8,3.4和4.8倍。考察了150℃时固化剂用揎、稀释剂丙酮用量对PAMAM1.0/环氧树脂体系固化时间的影响。DSC分析表明PAMAM1.0/环氧树脂体系在固化过程中分两阶段逐渐放热,且总放热量小于EDA/环氧树脂体系。TGA分析表明PAMAM1.0/环氧树脂体系固化产物开始大量分解的温度约为325℃,比EDA/环氧树脂体系高约10℃。

STUDY ON DENDRITIC POLY (AMININE-AMIDE) AS EPOXIDE HARDENER

Dendrimer (PAMAM1.0) with peripheral amimo groups was synthesized from methyl acrylate and ethylene diamine (EDA) by Michael addition reaction. Using PAMAM1.0 as epoxy resin hardener at 20℃,with the theoretical addition quantity and without diluent. The pot life and gel time of the PAMAM1.0/epoxy resin were 6.0 and 2.4 times as long as that of the EDA/epoxy resin respectively, while the curing speed was 1.8, 3.4 and 4.8 times as long as that of EDA/epoxy resin when cured at 95, 120, 150℃ respectively. Effects of curing temperature, mass content of hardener and acetone in PAMAM1.0/epoxy resin on the curing time were studied. DSC analysis showed that PAMAM1.0/epoxy resin gradually liberated heat in two stages during the curing process, and the total heat liberated was less than that of EDA/epoxy resin. TGA analysis indicated that the temperature at which the cured PAMAM1.0/epoxy resin began to degrade seriously at about 325℃,which is 10 ℃ higher than that of the cured EDA/epoxy resin.