Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys |
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Authors: | Anas M. Atieh Tahir I. Khan |
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Affiliation: | 1. Department of Mechanical and Manufacturing Engineering, University of Calgary, Calgary, AB, T2N 1N4, Canada 2. Qatar Petroleum Chair, Department of Mechanical and Industrial Engineering, University of Qatar, Doha, Qatar
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Abstract: | The transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles. Bond formation was attributed to two mechanisms; first, solid-state diffusion of Ni and Mg, followed by liquid eutectic formation at the Mg-AZ31 interface. Second, the solid-state diffusion of Ni and Ti at the Ti-6Al-4V interface resulted in a metallurgical joint. The joint interface was characterized by scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction analysis. Microhardness and shear strength tests were used to investigate the mechanical properties of the bonds. The use of Cu nanoparticles as a dispersion produced the maximum joint shear strength of 69 MPa. This shear strength value corresponded to a 15 % enhancement in joint strength compared to TLP bonds made without the use of nanoparticles dispersion. |
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