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Curing octaepoxysilsesquioxane with different curing agents
Authors:Zengping Zhang  Guozheng Liang  Changqing Fang  Jianzhong Pei  Shuanfa Chen
Affiliation:1. Key Laboratory for Special Area Highway Engineering of Ministry of Education, Chang'an University, Xi'an, Shaanxi 710064, People's Republic of China;2. Department of Polymer Engineering, Materials Engineering Institute, Soochow University, Suzhou, Jiangsu 215021, People's Republic of China;3. Printing and Packing Engineering Institute, Xi'an University of Technology, Xi'an, Shaanxi 710048, People's Republic of China
Abstract:Octaepoxysilsesquioxane (POSS-Ep) was first synthesized by the hydrolysis and condensation of γ-[(2,3)-epoxypropoxy]propyltrimethoxysilicane (KH-560) with the presence of ethanol and HCl at 55°C for 72 h. Then, it was cured with 4,4′-diaminodiphenylsulfone (DDS) and methylnadic anhydride (MNA), respectively. The curing reactions between POSS-Ep and DDS or MNA were investigated by FTIR. Thermal stability of the cured nanocomposites was studied by TGA. The micromophologies of the obtained hybrids were observed by SEM. FTIR results show that POSS-Ep can be cured completely with DDS or MNA to obtain the final organic–inorganic (O–I) hybrids after the same experimental curing cycle: 120°C/2 h + 140°C/2 h + 160°C/2 h + 180°C/2 h + 200°C/2 h. TGA results show that POSS-Ep/DDS hybrid displays better thermal stability than that of POSS-Ep/MNA hybrid. Initial thermal degradation temperature (Tdi) of POSS-Ep/DDS hybrid is 420°C, 195°C higher than that of POSS-Ep/MNA (225°C). SEM images of the fracture surfaces of the hybrids suggest the cured POSS-Ep possesses good mechanical properties. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012
Keywords:polyhedral oligomeric silsesquioxane  curing reaction  nanocomposites  4,4′-diaminodiphenylsulfone  methylnadic anhydride
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