磁控溅射制备成分渐变Au/Cu复合涂层的研究

在JGP560型高真空多功能磁控溅射设备上，利用直流磁控溅射法，通过控制共溅射时Au靶和Cu靶的功率变化，在平面基片和微球表面制备了一系列成分渐变的Au/Cu涂层，并用扫描电子显微镜和能量色散X射线荧光光谱仪对涂层的微观结构和成分进行了测试分析。分析结果表明：涂层内部的晶粒生长随Au和Cu含量的变化呈现出3个不同的区域；涂层中Au和Cu含量随涂层厚度的增加呈近线性变化的趋势；涂层内部晶粒之间结合紧密；涂层厚度均匀性良好，表面光洁。

Fabrication of Au/Cu Graded Bimetallic Alloy Coating With DC Magnetron Sputtering

Au/Cu bimetallic alloy coatings were prepared by direct current (DC) magnetron sputtering on the surfaces of Si substrates and glow discharge polymer (GDP) microspheres. The compositions of Au and Cu in Au/Cu alloy coating were controlled by tuning the sputting power of Au target and Cu target during the sputtering process. Scanning electron microscope (SEM) and energy disperse spectroscopy (EDS) were used to examine the structure, roughness, density and composition of the coatings. The results indicate that the compositions of Au and Cu change nearly linearly with the increase of the coating thickness. The surface roughness of the coating is good and the thicknesses of all the coatings are almost the same. The coating shows highly packed microstructures, with no interspaces between different grains.