| 热超声倒装过程中的建模和多参量仿真 |
| |
| 引用本文： | 李丽敏,吴运新,隆志力.热超声倒装过程中的建模和多参量仿真[J].半导体技术,2008,33(2):160-163. |
| |
| 作者姓名： | 李丽敏 吴运新 隆志力 |
| |
| 作者单位： | 中南大学,机电工程学院,长沙,410083;中南大学,机电工程学院,长沙,410083;中南大学,机电工程学院,长沙,410083 |
| |
| 基金项目： | 国家自然科学基金
,
国家重点基础研究发展计划(973计划) |
| |
| 摘 要： | 热超声键合是一个极其复杂的瞬态过程,利用常规手段不易了解此局部区域内的瞬态特性.针对这个问题,基于MSC.Marc大型非线性有限元分析软件建立了热超声倒装的几何模型,利用其强大的非线性分析能力对热声倒装进行了热力耦合有限元分析,得出了不同摩擦状况对正应力和切应力的分布及大小的影响,金凸点的塑性应变在键合界面上的分布及演变规律,切向位移加载前后键合界面所受正应力和切应力的大小及分布的变化情况,仿真结果对热超声倒装芯片连接工艺的理论研究有着重要的参考价值.
|
| 关 键 词： | 电子封装 热超声倒装 有限元分析 热力耦合 多参量仿真 |
| 文章编号： | 1003-353X（2008）02-0160-04 |
| 收稿时间： | 2007-09-25 |
| 修稿时间： | 2007年9月25日 |
Modeling and Multi-Parameter Simulation in Thermosonic Bonding Process |
| |
| Li Limin,Wu Yunxin,Long Zhili.Modeling and Multi-Parameter Simulation in Thermosonic Bonding Process[J].Semiconductor Technology,2008,33(2):160-163. |
| |
| Authors: | Li Limin Wu Yunxin Long Zhili |
| |
| Affiliation: | Li Limin,Wu Yunxin,Long Zhili (College of Mechanical , Electrical Engineering,Central South University,Changsha 410083,China) |
| |
| Abstract: | Thermosonic bonding is a very complicated transient process, so it is extremely difficult to find out the transient characteristics of the bonding interface in traditional ways. Aimed at it, the geometric model for the thermosonic flip chip was developed based on non-linear software MSC. Marc, and the process was analyzed by virtue of the powerful no-linear analysis capability of this software. The influence of the friction conditions on the distribution and value of the normal stress and shear stress, the distribution and evolution law of the plastic strain on the interface, and the change in value and distribution of the normal stress and shear stress before and after the displacement were obtained. All these results will be the reference to theoretical research on thermosonic flip-chip techniques. |
| |
| Keywords: | electronic packaging thermosonic flip-chip FEA thermal-mechanical couple multiparameters simulation |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
