Preparation of ultra-fine copper powder and its lead-free conductive thick film |
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Authors: | Songping Wu |
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Affiliation: | College of chemistry, South China University of Technology, Guangzhou 510641, China |
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Abstract: | In this paper, non-agglomerated monodispersed ultra-fine copper metallic powders have been synthesized with chemical reduction method. Fine lead-free glass powders were also prepared by solid synthesis process. Thick film paste prepared by above-mentioned copper metallic powders and lead-free glass powders was applied as conductive paste of MLCC. Mixture of glass and zinc oxide give the thick film a high adhesion strength which is attributed to the rough interface from interfacial reaction between glass and chip, and a good densification. Diffusion of metal between copper thick film and nickel thick film is clear. Ni-Cu solid solution appears under high temperature firing. |
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Keywords: | Thick film Ultra-fine Cu powders Lead-free glass Microstructure Solid solution |
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