Determination of mechanical properties of electroplated Ni thin film using the resonance method |
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Authors: | Sang-Hyun Kim |
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Affiliation: | Micro Device & System Lab., Samsung Advanced Institute of Technology, Mt. 14-1, Nongseo-dong, Giheung-gu, Younggin-si, Gyunggi-do, 449-712, Republic of Korea |
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Abstract: | This paper addresses a relatively simple method of measuring the mechanical properties such as Young's modulus and residual stress of electroplated Ni thin film using the resonance method of Atomic Force Microscope. Thin layer of nickel to be measured is electroplated onto the tip side of AFM silicon cantilever and plating thicknesses were measured at the end of each plating step. The measured Young's modulus of nickel at the end of each plating step ranged from 148.04 GPa to 159.90 GPa with the maximum standard deviation of 3.47. The end deflection of electroplated AFM cantilever is also measured as a function of the plated Ni thickness, which is converted into the film stress by appropriate mechanics. |
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Keywords: | Young's modulus Residual stress Electroplated Ni thin film Resonant frequency |
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