| Ti_2AlNb相合金Ti-22Al-25Nb的TLP扩散连接 |
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| 引用本文： | 邹贵生,白海林,谢二虎,吴爱萍,王庆,任家烈. Ti_2AlNb相合金Ti-22Al-25Nb的TLP扩散连接[J]. 稀有金属材料与工程, 2008, 37(12) |
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| 作者姓名： | 邹贵生 白海林 谢二虎 吴爱萍 王庆 任家烈 |
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| 作者单位： | 清华大学教育部先进成形制造重点实验室,北京100084 |
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| 基金项目： | 清华大学基础研究基金项目(Jcqn2005011) |
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| 摘 要： | 以Ti-15Cu-15Ni合金薄带作中间层，用Gleeble 1500D热-力学模拟试验机对Ti2AlNb相合金Ti-22Al-25Nb进行TLP扩散连接。研究了连接参数对接头组织演变、元素分布、接头强度及其断裂特征的影响。结果表明，接头形成过程由5个阶段组成，Nb是接头成分均匀化的扩散主控元素。适当延长保温时间和适当提高连接温度有利于获得组织与成分均匀的高强接头。保温结束后接头快速冷却时，其连接区室温组织为B2相；而采用慢冷工艺有利于促进高温β相的相变从而改善连接区组织，室温组织为B2相基体和少量α2、O相。连接温度和保温时间分别为990℃和90min且采用慢冷工艺时，接头的室温和650℃抗拉伸强度分别为1041MPa和659MPa，分别达到原始母材强度的95％和81％，明显高于采用快冷工艺的接头强度。
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| 关 键 词： | Ti2AlNb相合金 TLP扩散连接 显微组织 |
The TLP Diffusion Bonding of Ti_2AlNb-Based Alloy Ti-22Al-25Nb |
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| Zou Guisheng,Bai Hailin,Xie Erhu,Wu Aiping,Wang Qing,Ren Jialie. The TLP Diffusion Bonding of Ti_2AlNb-Based Alloy Ti-22Al-25Nb[J]. Rare Metal Materials and Engineering, 2008, 37(12) |
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| Authors: | Zou Guisheng Bai Hailin Xie Erhu Wu Aiping Wang Qing Ren Jialie |
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| Affiliation: | Zou Guisheng,Bai Hailin,Xie Erhu,Wu Aiping,Wang Qing,Ren Jialie (Key Laboratory of Ministry of Education for Advanced Manufacturing by Materials Processing Technology,Tsinghua University,Beijing 100084,China) |
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| Abstract: | Ti2AlNb-based alloy Ti-22Al-25Nb was joined with the transient liquid phase (TLP) diffusion bonding using the Ti-15Cu-15Ni film as interlayer on a thermal-mechanical simulator Gleeble 1500D. The effects of bonding parameters on the joint features such as microstructures, element distribution, tensile strength and fracture characteristics have been investigated. The formation of a joint consists of five steps, and Nb is the mainly controlling diffusion element to the formation of composition-homogenous bondi... |
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| Keywords: | Ti_2AlNb-based alloy TLP diffusion bonding microstructures |
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