| 选择性螯合滴定法测定电镀液和镀层中铜的含量 |
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| 引用本文： | 王献科,李玉萍.选择性螯合滴定法测定电镀液和镀层中铜的含量[J].电镀与涂饰,1996,15(3):9-12. |
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| 作者姓名： | 王献科 李玉萍 |
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| 作者单位： | 兰州市东岗镇钢厂 |
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| 摘 要： | 本法先用ＥＤＴＡ螯合Ｃｕ＾２＋和其他金属阳离子，然后加入ＤＬ－半胱氨酸作为释放剂分解Ｃｕ－ＥＤＴＡ释放出的ＥＤＴＡ用Ｐｂ＾２＋标准溶液返滴定，以ＸＯ－ＭＴＢ－ＣＰＢ为混合指示剂，滴定终点颜色变化敏锐，测定结果准确，并对多种金属离子的干扰进行了研究。
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| 关 键 词： | 化学分析 螯合滴定 铜 电镀 镀液 镀层 |
Selective Chelatometric Determination of Cu in Plating Solution and Deposit |
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| WANG Xianke, LI Yuping.Selective Chelatometric Determination of Cu in Plating Solution and Deposit[J].Electroplating & Finishing,1996,15(3):9-12. |
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| Authors: | WANG Xianke LI Yuping |
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| Affiliation: | WANG Xianke; LI Yuping |
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| Abstract: | The determination process is based on initial chelation of Cu2+ and other metal ions with EDTA and subsequent decomposition of Cu-EDTA with DL-cysteine as liberate agent. The liberated EDTA is titrated with Pb2+ standard solution using XO-MTB-CPB as alexed indicator. Titration end point is sensitive and determination result is accurate. Interference of various metal ions is also studied. |
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| Keywords: | chemical analysis selective chelatometry copper |
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