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Determination of the percentage of wood failure by 3D scanning of the adhesive bondline
Authors:Mirko Kariz  Milan Sernek
Affiliation:1. Department of Wood Science and Technology, Biotechnical Faculty, University of Ljubljana, Jamnikarjeva 101, 1001, Ljubljana, Slovenia
Abstract:The quality of the wood-adhesive bond is usually determined by its shear strength and the percentage of wood failure, the latter usually being determined by visual evaluation and prone to the examiner’s subjective evaluation. A new technique of 3D scanning was used to evaluate the percentage of wood failure, and the results obtained were compared to those obtained by means of existing methods, i.e. the visual evaluation and image analysis techniques. Evaluation by 3D scanning showed comparable values for samples with a high percentage of wood failure, but large differences in the case of samples showing mainly adhesive failure.
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