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| 无卤FPC材料 | |
| 引用本文： | 蔡积庆.无卤FPC材料[J].印制电路信息,2005(4):40-43. |
| 作者姓名： | 蔡积庆 |
| 摘 要： | 概述了覆铜板、涂覆层、粘结片和增强板等无卤FPC材料,旨在制造无卤FPC。 |
| 关 键 词： | 无卤FPC 覆铜板 涂层 粘结片 增强板 |
Halogen-Free FPC Material |
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| Cai Jiqing.Halogen-Free FPC Material[J].Printed Circuit Information,2005(4):40-43. | |
| Authors: | Cai Jiqing |
| Abstract: | This paper describes the copper-clad laminate,cover lay, bouding sheet and reinforcer etc. halogen-free FPC material, can suitable for manufacturing halogen-free FPC. |
| Keywords: | Halogen-free FPC copper-clad laminate cover lay bonding sheet reinforcer |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |