| Cu/Sn等温凝固技术在MEMS气密封装中的应用 |
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| 引用本文： | 李莉,焦继伟,王立春,吴艳红,罗乐,王跃林.Cu/Sn等温凝固技术在MEMS气密封装中的应用[J].固体电子学研究与进展,2007,27(3):371-374. |
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| 作者姓名： | 李莉 焦继伟 王立春 吴艳红 罗乐 王跃林 |
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| 作者单位： | 1. 中国科学院上海微系统与信息技术研究所,传感技术国家重点实验室,上海,200050;中国科学院研究生院,北京,100039
2. 中国科学院上海微系统与信息技术研究所,传感技术国家重点实验室,上海,200050 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 研究了Cu/Sn等温凝固键合技术在MEMS气密性封装中的应用。设计了等温凝固键合多层材料的结构和密封环图形,优化了键合工艺,对影响气密性的因素(如密封环尺寸等)进行了分析。在350°C实现了良好的键合效果,其最大剪切强度达到27.7MPa,漏率~2×10-4Pa·cm3/sHe,完全可以满足美国军方标准(MIL-STD-883E)的要求,验证了Cu/Sn等温凝固键合技术在MEMS气密封装中的适用性。
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| 关 键 词： | 等温凝固 气密封装 晶圆级封装 |
| 文章编号： | 1000-3819（2007）03-371-04 |
| 修稿时间： | 2005-11-07 |
Cu/Sn Isothermal Solidification Technology for Hermetic Packaging of MEMS |
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| LI Li,JIAO Jiwei,WANG Lichun,WU Yanhong,LUO Le,WANG Yuelin.Cu/Sn Isothermal Solidification Technology for Hermetic Packaging of MEMS[J].Research & Progress of Solid State Electronics,2007,27(3):371-374. |
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| Authors: | LI Li JIAO Jiwei WANG Lichun WU Yanhong LUO Le WANG Yuelin |
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| Affiliation: | 1.Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, State Key Laboratories of Transducer Technology, Shanghai, 200050, CHN;2.Graduate School of the Chinese Academy of Sciences, Beijing, 100039, CHN |
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| Abstract: | The paper introduces a novel hermetic packaging technology for MEMS based on Cu/Sn isothermal solidification(IS). We designed the structure of the intermediate multi-layer and the pattern of sealing rings, optimized the bonding process, and analyzed key factors affecting the hermeticity, such as the dimension of the sealing rings. Successful Cu/Sn IS bonding was realized at a low bonding temperature of 350°C under the optimal conditions. High shear strength of 27.7 MPa and excellent leak rate of around 2×10-4 Pa·cm3/s He have been achieved, which meet the requirements of MIL-STD-883E. |
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| Keywords: | isothermal solidification(IS) hermetic package wafer-level package |
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