形状记忆合金CuZnAl的扩散焊接头组织性能

采用铜、镍为中间层，研究了形状记忆合金CuZnAl扩散焊的焊接性能。利用金相显微镜、扫描电镜、电子探针对接头进行了微观分析。结果表明：不加中间层或采用铜为中间层焊接效果不好；而采用镍为中间层时，试样经扩散焊后，焊缝区窄、变形小，锌、铝挥发较少，相变点比焊前略低，焊后接头拉伸强度比母材有所降低，断口呈脆性断裂，其形状记忆指数可达到母材的91％。

Weldability of CuZnAl alloy in diffusion bonding

Adopting copper and nickel as interlayer, the weldability of CuZnAl alloy diffusion bonding was studied. The results show that, the joint of diffusion bonding has poor weldability without interlayer or using copper as interlayer; but using nickel as interlayer it has little deformation, narrow HAZ, slight volatilization of Zn and Al, low transition point, and the ratio of shape memory recovery of the joint to the matrix is 91%. By tensile tests, the joint shows brittle fracture which makes its tensile strength lower than the matrix.