| 湿法缠绕用次中温固化的环氧树脂配方 |
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| 引用本文： | 苏祖君,梁国忠,曾金芳,王华强.湿法缠绕用次中温固化的环氧树脂配方[J].纤维复合材料,2004,21(3):6-8,29. |
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| 作者姓名： | 苏祖君 梁国忠 曾金芳 王华强 |
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| 作者单位： | 1. 航天科技集团四院四十三所,710025
2. 江西工业工程职业技术学院,337055 |
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| 摘 要： | 采用自制改性液态芳香胺制得一种低粘度次中温固化环氧树脂体系，通过不同升温速率下的固化过程DSC扫描，研究了该体系的固化反应动力学，并据其优化了体系的固化制度。结果表明，该体系的表观固化反应活化能为38．54kJ／mol，反应级数为0．84。固化度和FT—IR测试表明，体系可在90℃次中温环境中达到固化完全。体系综合性能优良，可满足复合材料湿法缠绕成型对高性能树脂基体的要求。
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| 关 键 词： | 中温固化 湿法缠绕 环氧树脂 固化反应动力学 固化过程 低粘度 固化度 系综 反应级数 活化能 |
Study on the Low - moderate Temperature Curing Epoxy Formula Used in Wet Winding Process |
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| Su Zujun Liang Guozhong Zeng Jinfang Wang Huaqiang.Study on the Low - moderate Temperature Curing Epoxy Formula Used in Wet Winding Process[J].Fiber Composites,2004,21(3):6-8,29. |
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| Authors: | Su Zujun Liang Guozhong Zeng Jinfang Wang Huaqiang |
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| Affiliation: | Su Zujun1 Liang Guozhong2 Zeng Jinfang1 Wang Huaqiang1 |
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| Abstract: | In this article, a low viscosity epoxy resin curing system under low-moderate temperature is acquired by adopting a liquid aromatic amine made by ourselves. The DSC analysis is used to study the curing reaction kinetics of this resin system. Results show that the surface active energy of this curing system is 38.54kJ/mol and the reaction order is 0.84. The test of the curing degree and FT-IR show that the resin can be cured completely under low-moderate temperature. The multiple properties of this epoxy resin curing system are excellent and can meet the requirement of the wet winding process. |
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| Keywords: | wet winding curing under low-moderate temperature epoxy resin |
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