电子封装固化剂苯酚-芳烷基型树脂的合成

以苯酚和对苯二甲醇为单体、浓盐酸为催化剂,经Friedel-Crafts烷基化反应合成了苯酚-芳烷基型树脂。利用傅里叶变换红外光谱、核磁共振、凝胶渗透色谱等技术分别对产物的结构、相对分子质量及其分布进行了表征。表征结果显示,经Friedel-Crafts烷基化反应得到的苯酚-芳烷基型树脂为苯酚邻、对位取代的混合物;随苯酚用量的增加,苯酚-芳烷基型树脂的相对分子质量逐渐减小,相对分子质量分布逐渐变窄。与线型酚醛树脂相比,苯酚-芳烷基型树脂中的羟基数量较少,与环氧树脂固化后所剩的羟基数量更少,固化后的环氧树脂塑封料具有优良的耐湿性,24h的吸水率小于0.07%。

Synthesis of Phenol-Aralkyl Resin as Curing Agent for Electronic Packaging

Phenol-aralkyl resin was prepared by Friedel-Crafts alkylation of phenol and terephthalyl alcohol as monomers with hydrochloric acid as catalyst.The resin was used as curing agent in epoxy molding compounds for electronic packaging.The structure of the product resin was characterized by means of FTIR and 13C NMR.GPC was used to determine relative molecular mass and its distribution of the resin.Phenol-aralkyl resin obtained by Friedel-Crafts alkylation was a mixture of ortho and para substituted phenol-aralkyl resins.The more mass fraction of phenol was added,the smaller relative molecular mass and the narrower relative molecular mass distribution of the resin.The resin contained less hydroxyl groups and larger hydroxyl equivalent weight than phenolic-novolak resin.Moreover,less hydroxyl groups were left after curing with epoxy resin.Therefore after curing the water absorbency of epoxy molding compounds or electronic packaging lowered.Taking the prepared phenol-aralkyl resin as curing agent,the water absorption of the improved epoxy moulding compounds is less than 0.07% in 24 h.