| 表面活化连接/SAB微电子系统超高密度互连技术 |
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| 引用本文： | 徐忠华,须贺唯知.表面活化连接/SAB微电子系统超高密度互连技术[J].电子工业专用设备,2004,33(9):53-57. |
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| 作者姓名： | 徐忠华 须贺唯知 |
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| 作者单位： | 无锡艾克柏国际微电子科技有限公司,无锡市新工猎江路21号,江苏,无锡,214035;日本东京大学,东京都目黑区驹场4-6-1,日本东京;日本东京大学,东京都目黑区驹场4-6-1,日本东京 |
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| 摘 要： | 介绍一种微电子系统用新型超高密度、高可靠互连方法及表面活化连接(SAB)技术。同种或者不同材料之间,经过洁净和表面活化处理之后,在一定条件下,适当的压力下可以获得非常可靠的连接,同传统的引线键合、焊料球倒装焊、导电胶连接等相比,SAB具有明显的优势,特别适合于开发高集成度、微小型的电子装置。并介绍相关的SAB室温连结装置以及低温SAB倒装焊机,SAB技术用于开发新型微电子系统的一些具体例子。
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| 关 键 词： | 室温 倒装焊 可靠性 界面 |
| 文章编号： | 2004-4507(2004)09-0053-05 |
| 修稿时间： | 2004年8月13日 |
Surface Activated Bonding/SAB A New High Density Interconnection Technology for Microelectronic System |
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| Zhonghua Xu,Tadatomo Suga.Surface Activated Bonding/SAB A New High Density Interconnection Technology for Microelectronic System[J].Equipment for Electronic Products Marufacturing,2004,33(9):53-57. |
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| Authors: | Zhonghua Xu Tadatomo Suga |
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| Affiliation: | Zhonghua Xu1,2,Tadatomo Suga2 |
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| Abstract: | A new high density, high reliable interconnection technology, surface activated bonding (SAB) was introduced in this paper. Same or different materials, after cleaning and surface activted, could be bonded together successfully under a certain condition. As compared with traditional flip chip, wire bonding or conductive paste connection methods, SAB has obvious advantage, and is specially helpful for the development of small electronic sets. Related SAB equipments, also application will be introduced in the paper. |
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| Keywords: | Room temperature Flip chip Reliability Interface |
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