Micropatterning of sulfonated polyaniline using a soft lithography based lift-off process

A combination of soft lithography and lift-off processing is presented for the fabrication of sulfonated polyaniline (SPAN) microstructures. A soft lithography based micromolding process was used to pattern sacrificial layers using a thermoplastic polymer. SPAN was then polymerized in situ to coat the patterned substrate. The sacrificial layer was removed by lift-off in an organic solvent, leaving the patterned SPAN on the substrate. This process was performed on several rigid and flexible substrates including glass, silicon, and polyimide. The film thickness and roughness were measured as a function of reaction time using atomic force microscopy. Patterns were also imaged using scanning electron microscopy. This process provides a cost effective and versatile method of patterning SPAN and has potential applications in a number of conducting polymer devices.