锑化铟红外焦平面器件信号分层问题研究

锑化铟红外焦平面器件在杜瓦测试中常常会出现信号分层问题，影响了器件制造的成品率。通过对器件杜瓦测试电平图、管芯电流电压测试结果以及衬底掺杂浓度进行实验研究，定位了造成探测器信号分层问题的原因。进一步的理论分析也表明了锑化铟衬底上局部存在的高浓度掺杂区域对器件性能造成的影响。基于此研究，在芯片制备过程中可采取相应措施，最大限度地避免后道工序中的无效工作，进而提高锑化铟焦平面器件工艺线的流片效率。

Study on Signal Layering of InSb Infrared Focal Plane Arrays

The problem of signal layering often occurs in Dewar testing of InSb infrared focal plane arrays (IRFPA) detector. This problem reduces the rate of finished product. By analyzing the Dewar test result, I-V curve, and the substrate doping concentration, we have located the cause of detector signal layering. Theoretical analysis also shows the effect of high concentration doped regions of the InSb substrate on device performance. Based on this research, we can take corresponding measures in the process of InSb IRFPA fabrication, avoid the invalid work and improve the yield.