首页 | 本学科首页   官方微博 | 高级检索  
     


Using silica nanoparticles as curing reagents for epoxy resins to form epoxy–silica nanocomposites
Authors:Ying‐Ling Liu  Shu‐Hsien Li
Abstract:Nanoscale colloidal silica showed high reactivity toward curing epoxy resins to form epoxy–silica nanocomposites under mild conditions. Adding a certain amount (5000 ppm) of magnesium chloride lowered the activation energy of the reaction from 71 to 46 kJ/mol. Less and more magnesium chloride both exhibited counter action on lowering the activation energy of the curing reaction. Tin chloride dihydrate and zinc acetylacetonate hydrate were also added into the curing compositions, however, showing no significant effect on promoting the curing reaction. Through this curing reaction, epoxy–silica nanocomposites containing high silica contents up to 70 wt % were obtained. Therefore, this reaction provided a novel and convenient route in preparation of epoxy–silica nanocomposites. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 95: 1237–1245, 2005
Keywords:curing of polymers  epoxy  nanocomposites  silicas  nanoparticles
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号