| 化学镀钯工艺的研究 |
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| 引用本文： | 樊群峰,司新生,张海娟,张沁. 化学镀钯工艺的研究[J]. 应用化工, 2009, 38(6): 908-910 |
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| 作者姓名： | 樊群峰 司新生 张海娟 张沁 |
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| 作者单位： | 陕西省石油化工研究设计院,陕西,西安,710054 |
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| 摘 要： | 采用无氧紫铜为基材,施镀条件为:pH=9.8±0.1,温度45~55℃,研究了化学镀钯工艺。结果表明,化学镀钯液优化组成为:3 g/L PdCl2,10~15 g/L NaH2PO2,160 mL/L NH4OH(28%),40 g/L NH4Cl。镀液稳定性好、温度范围宽,易于施镀、便于维护。所得镀层均匀、平整、半光亮。
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| 关 键 词： | 化学镀 钯 镀层 沉积速率 稳定性 |
Study on chemical palladium-plating process |
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| FAN Qun-feng,SI Xin-sheng,ZHANG Hai-juan,ZHANG Qin. Study on chemical palladium-plating process[J]. Applied chemical industry, 2009, 38(6): 908-910 |
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| Authors: | FAN Qun-feng SI Xin-sheng ZHANG Hai-juan ZHANG Qin |
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| Abstract: | Using non-oxo copper as substrate,the condition of application plated is pH=9.8±0.1,temperature is 45~55 ℃.The process of chemical palladium plating was studied.The result showed that the optimization of component of chemical palladium-plating is PdCl is 3 g/L,NaH2PO2 is 10~15 g/L,NH4OH is 160 mL/L,NH4Cl is 40 g/L.The solution have good stability,wide range of temperature easy to application plating and maintenance,coating is uniform,half a bright. |
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| Keywords: | chemical plating palladium coating deposition rate solubility |
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