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Etching Effect on CMP of Different GaN Layers
Authors:Chen Xiufang  Siche Dietmar  Rost Hans-Joachim  Schulz Tobias  Albrecht Martin  Xu Xiangang State Key Laboratory of Crystal Materials  Sh  ong University  Jinan  China
Affiliation:Chen Xiufang1,Siche Dietmar2,Rost Hans-Joachim2,Schulz Tobias2,Albrecht Martin2,Xu Xiangang1 1 State Key Laboratory of Crystal Materials,Shandong University,Jinan 250100,China,2 Institute of Crystal Growth,Max-Born-Str. 2,12489 Berlin,Germany
Abstract:Chemical mechanical polishing (CMP) was used to etch various GaN materials, such as GaN layers on sapphire and silicon carbide substrates grown by metal-organic chemical vapor deposition and thick GaN layers grown by physical vapor transport. It was found that CMP could reveal the dislocations in GaN surfaces due to a selective etching component. After the optimization of CMP condition, the surface finish improved and the subsurface damage was almost completely removed, demonstrated by atomic force microsco...
Keywords:surface  etch pits  CMP  GaN  
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