| 42Sn58Bi—96.5Sn3.5Ag系焊点疲劳性能的研究 |
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| 引用本文： | 汤清华 Wu.,L. 42Sn58Bi—96.5Sn3.5Ag系焊点疲劳性能的研究[J]. 电子器件, 1999, 22(2): 87-92 |
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| 作者姓名： | 汤清华 Wu. L |
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| 作者单位： | 华中理工大学电子科学与技术系，香港城市大学 |
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| 摘 要： | 本文研究了热处理时间对不同组分的４２Ｓｎ５８Ｂｉ－９６．５Ｓｎ３．５Ａｇ焊料疲劳性能的影响，研究发现适当的热处理时间能提高焊点的机械强度，延长焊点的疲劳寿命。
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| 关 键 词： | 焊点 热处理 疲劳特性 无铅焊料 实验 |
The Study of the Fatigue Property of 42Sn58Bi 96.5Sn3.5Ag System Solder Joint |
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| Tang Qing hua, Pan Xiao guang. The Study of the Fatigue Property of 42Sn58Bi 96.5Sn3.5Ag System Solder Joint[J]. Journal of Electron Devices, 1999, 22(2): 87-92 |
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| Authors: | Tang Qing hua Pan Xiao guang |
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| Abstract: | The effect of annealing time on fatigue property of the different composition of 42Sn58Bi 96.5Sn3.5Ag (Sn Bi Sn Ag) system solder joint has been studied. It was found that the suitable ratio of Sn Ag can raise the solder temperature of solder joint and improve the mechanical and fatigue properties. It was also found that suitable annealing can effect the various properties of solder joint, too. |
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| Keywords: | Sn58Bi 96.5Sn3.5Ag solder joint annealing fatigue property |
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