| 高速PCB电源完整性研究 |
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| 引用本文： | 白同云.高速PCB电源完整性研究[J].中国电子科学研究院学报,2006,1(1):22-30. |
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| 作者姓名： | 白同云 |
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| 作者单位： | 清华大学工程物理系,北京,100084 |
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| 摘 要： | 一块成功的高速印刷电路板(PCB),需要做到信号完整性和电源完整性,首先必须降低地弹.为了滤除地弹骚扰,推荐在电源/地平面对上,安放去耦电容。
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| 关 键 词： | 高速印刷电路板(PCB) 信号完整性 电源完整性 地弹 电源/地平面对 去耦电容 |
| 文章编号： | 1673-5692（2006）01-022-09 |
| 收稿时间： | 2005-12-16 |
| 修稿时间： | 2006-02-12 |
Research into High Speed PCB Power Integration |
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| BAI Tong-yun.Research into High Speed PCB Power Integration[J].Journal of China Academy of Electronics and Information Technology,2006,1(1):22-30. |
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| Authors: | BAI Tong-yun |
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| Affiliation: | Department of Engineering Physics Tsinghua University, Beijing 100084 |
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| Abstract: | A successful high-speed printed circuit board(PCB) requires signal integrity and power integrity,must reduce the effects of ground bounce.To filter ground bounce noise,recommends placing the decoupling capacitors to Vcc and ground pair. |
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| Keywords: | high-speed printed circuit board(PCB) signal integrity power integrity ground bounce Vcc and ground pair decoupling capacitor |
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