| 化学共沉积AgNi(10)电触点材料的制备及性能分析 |
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| 引用本文： | 黄光临,颜小芳,李国伟,李艳. 化学共沉积AgNi(10)电触点材料的制备及性能分析[J]. 电工材料, 2010, 0(1): 12-16 |
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| 作者姓名： | 黄光临 颜小芳 李国伟 李艳 |
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| 作者单位： | 福达合金材料股份有限公司,浙江温州,325025 |
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| 摘 要： | 采用化学共沉积工艺制备AgNi(10)粉末,经烧结、挤压、拉拔加工成线材,并与机械混粉、烧结、挤压制备的AgNi(10)线材进行了对比。结果表明,化学共沉积工艺不仅能有效地解决Ni颗粒的团聚,还能使Ni颗粒均匀弥散地分布于银基体中,因而提高了AgNi(10)的使用性能。
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| 关 键 词： | AgNi（10） 共沉积 电接触材料 |
Preparation and Performance Analysis of AgNi(10) Electrical Contact Material by Chemical Co-deposition |
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| HUANG Guang-lin,YAN Xiao-fang,LI Guo-wei,LI Yan. Preparation and Performance Analysis of AgNi(10) Electrical Contact Material by Chemical Co-deposition[J]. Electrical Engineering Materials, 2010, 0(1): 12-16 |
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| Authors: | HUANG Guang-lin YAN Xiao-fang LI Guo-wei LI Yan |
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| Affiliation: | Fuda Alloy Materials Co.Ltd.;Wenzhou 325025;China |
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| Abstract: | A new manufacturing method of AgNi(10) wire was introduced.The method involves the chemical co-deposition,sintering,extrusion and drawing.Comparison was also made with the AgNi(10) wire manufactured by mixing method.The result shows that the performance of AgNi(10) wire with chemical co-deposition is much better than that of the traditional's.The chemical co-deposition process is not only effectively solved the aggregation of Ni particles,but also make the nickel-silver particles to distribute in the silver... |
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| Keywords: | AgNi(10) |
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