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液相连接氮化硅陶瓷的结合强度研究
引用本文:解荣军,黄莉萍,陈源,徐鑫,符锡仁.液相连接氮化硅陶瓷的结合强度研究[J].无机材料学报,1998,13(5):763-768.
作者姓名:解荣军  黄莉萍  陈源  徐鑫  符锡仁
作者单位:中国科学院上海硅酸盐研究所; 上海 200050
基金项目:上海市自然科学基金!97ZE14037
摘    要:本文用玻璃焊料研究了氮化硅陶瓷的液相连接,探讨了组份(0~10wt%α-Si3N4)、温度(1450~1650℃)和保温时间(10~120min)对结合强度的影响规律.结果表明,α-Si3N4的加入提高了液态焊料的粘度,降低了焊料的流动性,导致结合强度下降.采用组份为不含α-Si3N4的纯氧化物玻璃焊料在1600℃、保温30min可以得到较为理想的结合强度.

关 键 词:氮化硅  连接  结合强度  
收稿时间:1997-7-10
修稿时间:1997-8-20

Bond Strength of Joined Silicon Nitride Ceramics by Liquid Phase Bonding Method
XIE Rong-Jun,HUANG Li-Ping,CHEN Yuan,XU Xin,FU Xi-Ren.Bond Strength of Joined Silicon Nitride Ceramics by Liquid Phase Bonding Method[J].Journal of Inorganic Materials,1998,13(5):763-768.
Authors:XIE Rong-Jun  HUANG Li-Ping  CHEN Yuan  XU Xin  FU Xi-Ren
Affiliation:Shanghai Institute of Ceramics; Chinese Academy of Sciences Shanghai 200050 China
Abstract:The liquid phase bonding of silicon nitride ceramics by using glass adhesives was studied. The effects of adhesive composition and joining conditions such as temperature (1450~1650℃) and holding time (10~120min) on the bond strength of the joint were investigated. The results showed that increasing viscosity of the adhesive by the addition of α-Si3N4 powder to the glass, and consequently reducing fluidity of the adhesive degraded the bond strength. The op
Keywords:silicon nitride  bonding  bond strength
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