| 通孔回流焊技术的研究 |
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| 引用本文： | 鲜飞.通孔回流焊技术的研究[J].电子工业专用设备,2006,36(2):58-60. |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | 介绍了通孔回流焊的概念、特点、分类和使用工艺要点。选择性焊接是现代组装技术的新概念,它的出现促进了SMT(表面贴装技术)的发展,并为PCB设计者提供了新的工艺选择。可以确信选择性焊接将会被更多地应用于电子组装上,成为一种具有竞争力的焊接技术。
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| 关 键 词： | 通孔回流焊 印刷线路板 模板 |
| 文章编号： | 1004-4507(2006)02-0058-03 |
| 收稿时间： | 12 30 2005 12:00AM |
| 修稿时间： | 2005年12月30 |
The Research of Through-hole Reflow |
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| Xian Fei.The Research of Through-hole Reflow[J].Equipment for Electronic Products Marufacturing,2006,36(2):58-60. |
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| Authors: | Xian Fei |
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| Affiliation: | Fiberhome Telecommunication Technologies Co., Ltd, Wuhan 430074, China |
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| Abstract: | The things of through-hole reflow's concept, characteristics, division and technical gist are described in this paper. Through-hole reflow is a new concept of the contemporary assembly technolog y. It issaid that selective soldering has developed and innovated SMT since it was appeared and also provides anew choice for PCB designer. It is believed that through-hole reflow will more be adopted in electronicsassembly, and will also be a competitive soldering technology. |
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| Keywords: | Through-hole reflow PCB Stencil |
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