Investigation of the interfacial structure of ultra-thin platinum film deposited by cathodic–arc

Ultra-thin films are of interest in the production of X-ray mirrors that use a multilayer structure. The most commonly used deposition techniques are dc magnetron sputtering and electron beam evaporation; this paper presents results of cathodic–arc deposition. Ultra thin films of platinum with nominal thicknesses in the range 15–65 Å were deposited on silicon substrates and the film structure investigated using X-ray reflectivity and X-ray photoelectron spectroscopy. It has been found that the structure of the deposited films consists of three layers—the platinum film, a silicon oxide layer and a platinum silicide layer. In contrast to dc magnetron and electron beam deposited films, the silicide layer of cathodic–arc deposited films have a higher density and greater thickness, which is attributed to the higher energy process of this deposition technique. These attributes of the cathodic–arc deposited films suggest that the deposition technique is not suitable for production of mirrors of materials that react with each other, but for materials that do not the deposition technique is potentially more favourable than that of e-beam and magnetron sputtering.