| 焊盘尺寸对SMT焊点可靠性的影响 |
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| 引用本文： | 黄红艳,周德俭,吴兆华.焊盘尺寸对SMT焊点可靠性的影响[J].桂林电子科技大学学报,2003,23(1):34-37. |
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| 作者姓名： | 黄红艳 周德俭 吴兆华 |
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| 作者单位： | 桂林电子工业学院,机电与交通工程系,广西,桂林,541004 |
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| 摘 要： | 随着电子产品不断的小型化、多功能化以及数字化发展 ,表面组装技术 SMT(Surface MountTechnology)作为一种最新的电子装联技术 ,已经渗透到各个技术领域 ,并且应用日趋普及、广泛。对于电子产品质量的控制和保证也越来越受到人们的重视。其中 ,焊点焊接质量的好坏直接影响着产品的质量优劣。因此分析影响焊接质量的各种因素和探讨如何增强焊点质量的可靠性也就一直得到较多的关注 ,而焊点形态工艺参数是影响焊点可靠性的重要因素之一
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| 关 键 词： | SMT 电子装联 可靠性 |
| 文章编号： | 1001-7437(2003)01-34-04 |
| 修稿时间： | 2002年10月23 |
Effect of the Solder Pad Size on the Reliability of the Solder Joint |
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| HUANG Hong yan,ZHOU De jian,WU Zhao hua.Effect of the Solder Pad Size on the Reliability of the Solder Joint[J].Journal of Guilin Institute of Electronic Technology,2003,23(1):34-37. |
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| Authors: | HUANG Hong yan ZHOU De jian WU Zhao hua |
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| Abstract: | As electronic products are being developed into models of minimization,multifunction and digitization,SMT(Surface Mount Technology) has been applied in many fields.Quality control and quality guarantee of the electronic products have been the main concern of consumers.Solder welding quality directly affects the quality of the finished product.Therefore,how to enhance solder joint reliability and analysis of the factors affecting the welding have been given much attention.In this paper,the effects of the solder pad size on the reliability of the solder joint are discussed. |
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| Keywords: | SMT reliability electronic interconnection |
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