| 热循环加载片式元器件带空洞无铅焊点的可靠性 |
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| 引用本文： | 王斌,黄春跃,李天明. 热循环加载片式元器件带空洞无铅焊点的可靠性[J]. 电子元件与材料, 2011, 30(6): 66-69 |
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| 作者姓名： | 王斌 黄春跃 李天明 |
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| 作者单位： | 桂林电子科技大学机电工程学院;桂林航天工业高等专科学校汽车与动力工程系; |
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| 基金项目： | 广西壮族自治区自然科学基金资助项目(No.0832083); 广西壮族自治区教育厅科研资助项目(No.200911MS270); 广西制造系统与先进制造技术重点实验室基金资助项目(No.07109008_011_Z) |
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| 摘 要： | 建立了片式元器件带空洞无铅焊点有限元分析模型,研究了热循环加载条件下空洞位置和空洞面积对焊点热疲劳寿命的影响.结果表明:热循环加载条件下空洞位置和空洞面积显著影响焊点热疲劳寿命.空洞位置固定于焊点中部且面积分别为7.065×10-4,1.256×10-3,1.963×10-3和2.826×10-3mm2时,焊点热疲劳寿...
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| 关 键 词： | 片式元器件 无铅焊点 空洞 有限元分析 热疲劳寿命 |
Reliability of chip components lead-free solder joints with voids under thermal cycle |
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| WANG Bin,HUANG Chunyue,LI Tianming. Reliability of chip components lead-free solder joints with voids under thermal cycle[J]. Electronic Components & Materials, 2011, 30(6): 66-69 |
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| Authors: | WANG Bin HUANG Chunyue LI Tianming |
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| Affiliation: | WANG Bin1,HUANG Chunyue1,LI Tianming2(1.School of Electro-Mechanical Engineering,Guilin University of Electronic Technology,Guilin 541004,Guangxi Zhuangzu Zizhiqu,China,2.Department of Automobile and Power Engineering,Guilin College of Aerospace Technology,China) |
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| Abstract: | The finite element analysis(FEA) models of chip component lead-free solder joints with voids were set up,the effects of void location and void area on the thermal fatigue life of lead-free solder joints were studied under thermal cycle.The results show that both the void location and the void area possess significant effects on the thermal fatigue life of solder joints.With the fixed location in the middle of solder joints when the void areas are 7.065×10–4,1.256×10–3,1.963×10–3 and 2.826×10–3 mm2 respectively,the solder joint fatigue lives are 1 840,2 022,1 464 and 1 461 cycles.The thermal fatigue life of solder joints with small void area is not longer than that of solder joints with large void area. |
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| Keywords: | chip components lead-free solder joint void finite element analysis thermal fatigue life |
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