| 纳米颗粒增强无铅复合焊料的研究现状 |
| |
| 引用本文： | 马运柱,李永君,刘文胜.纳米颗粒增强无铅复合焊料的研究现状[J].电子元件与材料,2011,30(6):79-83. |
| |
| 作者姓名： | 马运柱 李永君 刘文胜 |
| |
| 作者单位： | 中南大学粉末冶金国家重点实验室; |
| |
| 基金项目： | 国家配套资助项目(No.JPPT—115—2—1057) |
| |
| 摘 要： | 熔化温度、润湿性及长期使用过程中的可靠性决定了无铅焊料的应用范围.通过添加适量纳米颗粒可显著提高无铅焊料的性能,特别是添加适量纳米Ag颗粒后SnCu焊料蠕变断裂寿命是未添加时的13倍.介绍了添加纳米颗粒对无铅焊料的物理化学性能的影响;探讨了纳米颗粒增强无铅复合焊料微观结构和力学性能;展望了纳米颗粒增强手段对焊料应用的前...
|
| 关 键 词： | 无铅复合焊料 纳米颗粒 综述 添加 |
Research development of nano-composite lead-free solders |
| |
| MA Yunzhu,LI Yongjun,LIU Wensheng.Research development of nano-composite lead-free solders[J].Electronic Components & Materials,2011,30(6):79-83. |
| |
| Authors: | MA Yunzhu LI Yongjun LIU Wensheng |
| |
| Affiliation: | MA Yunzhu,LI Yongjun,LIU Wensheng(State Key Laboratory for Powder Metallurgy,Central South University,Changsha 410083,China) |
| |
| Abstract: | The application of lead-free solder mostly depends on its melting temperature,wetting property and reliability in the course of long-term service.The properties of lead-free solder are enhanced effectively by trace amount of nano-particles addition.In particular,the creep rupture life of SnCu solder adding nano-Ag particle is thirteen times that of non-added SnCu solder.The effects of nano-particles on physical and chemical properties of lead-free solder are introduced.The microstructure and mechanical prop... |
| |
| Keywords: | composite lead-free solder nano-sized particles review adding |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
