| 回流次数对Sn3.8Ag0.7Cu-xNi/Ni焊点的影响 |
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| 引用本文： | 刘平,顾小龙,姚琲,赵新兵,刘晓刚.回流次数对Sn3.8Ag0.7Cu-xNi/Ni焊点的影响[J].电子元件与材料,2011,30(6):53-57. |
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| 作者姓名： | 刘平 顾小龙 姚琲 赵新兵 刘晓刚 |
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| 作者单位： | 浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室;浙江大学材料科学与工程学系;天津大学材料科学与工程学院; |
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| 基金项目： | 浙江省2010年自然科学基金资助项目(No.Y4100809) |
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| 摘 要： | 研究了复合无铅焊料Sn3.8Ag0.7Cu-xNi(x=0.5,1.0,2.0)与Au/Ni/Cu焊盘在不同回流次数下形成的焊点的性能.结果表明,Ni颗粒增强的复合焊料具有良好的润湿性能,熔点小于222℃;X为0.5的焊料界面IMC由针状(CuNi)6Sn5演化为双层IMC,即多面体状化合物(CuNi)6Sn5和回飞棒...
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| 关 键 词： | 复合无铅焊料 Sn3.8Ag0.7Cu 金属间化合物 回流 |
Effects of multiple reflows on Sn3.8Ag0.7Cu-xNi/Ni solder joints |
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| LIU Ping,GU Xiaolong,YAO Pei,ZHAO Xinbing,LIU Xiaogang.Effects of multiple reflows on Sn3.8Ag0.7Cu-xNi/Ni solder joints[J].Electronic Components & Materials,2011,30(6):53-57. |
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| Authors: | LIU Ping GU Xiaolong YAO Pei ZHAO Xinbing LIU Xiaogang |
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| Affiliation: | LIU Ping1,2,GU Xiaolong1,YAO Pei3,ZHAO Xinbing2,LIU Xiaogang1(1.Zhejiang Province Key Laboratory of soldering & Brazing Materials and Technology,Zhejiang Metallurgical Research Institute,Hangzhou 310011,China,2.Department of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,3.College of Material Science and Engineering,Tianjin University,Tianjin 300072,China) |
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| Abstract: | The composite lead-free solders Sn3.8Ag0.7Cu-xNi(x=0.5,1.0,2.0) were produced,the properties of the solders joints with Au/Ni/Cu pads were studied in different reflow numbers.Results show that the composites solders have optimal wetting ability compared with that of without Ni-adding.The melting point is less than 222 ℃.The intermetallic compounds(IMC) alters from the needle-like(CuNi)6Sn5 of the joint without Ni-adding to dual layers of polyhedron(CuNi)6Sn5 and boomerang shape(NiCu)3Sn4 when x=0.5,and only boomerang shape(NiCu)3Sn4 is formed at the interface between the composite solder and Ni layer when x exceeds 1.0.The shear strength of solder joints is higher than that without Ni-adding. |
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| Keywords: | composite lead-free solder Sn3 8Ag0 7Cu intermetallic compound reflow |
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