| 层叠封装热疲劳寿命的有限元法分析 |
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| 引用本文： | 任超,罗成,谢秀娟,丁俊,徐文正. 层叠封装热疲劳寿命的有限元法分析[J]. 电子元件与材料, 2011, 30(6): 70-73 |
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| 作者姓名： | 任超 罗成 谢秀娟 丁俊 徐文正 |
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| 作者单位： | 中国航空综合技术研究所;中国科学院理化技术研究所; |
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| 基金项目： | 航空科学基金资助项目(No.20090246001) |
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| 摘 要： | 针对典型的层叠封装建立了三维有限元模型,并采用有限元方法对封装在热循环载荷下的行为进行了数值模拟.在模拟计算中,Anand的粘塑性本构方程被用来描述SnAgCu焊球的力学行为.利用Engelmaier修正的Coffin-Masson疲劳公式对最易失效的焊球进行了寿命计算.结果表明,层叠封装中下层焊球的应力大于上层焊球,...
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| 关 键 词： | 层叠封装 有限元法 热疲劳寿命 |
Analysis on the thermal fatigue life of PoP using finite element method |
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| REN Chao,LUO Cheng,XIE Xiujuan,DING Jun,XU Wenzheng. Analysis on the thermal fatigue life of PoP using finite element method[J]. Electronic Components & Materials, 2011, 30(6): 70-73 |
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| Authors: | REN Chao LUO Cheng XIE Xiujuan DING Jun XU Wenzheng |
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| Affiliation: | REN Chao1,LUO Cheng1,XIE Xiujuan2,DING Jun1,XU Wenzheng1(1.China Aero Poly-technology Establishment,Beijing 100028,China,2.Technical Institute of Physical and Chemistry,China Academy of Science,Beijing 100190,China) |
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| Abstract: | A 3-D finite element model of PoP(Package on Package) was built,and the behavior of PoP subjected to thermal cycling was simulated using the finite element method.In the simulation,Anand's visco-plasticity constitutive equation was used to describe the mechanic behavior of SnAgCu solder balls.The fatigue life of the most dangerous solder balls was calculated using the Coffin-Masson formula modified by Engelmaier.The results show that the stress in the balls of the bottom array is higher than that in the bal... |
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| Keywords: | Package on package(PoP) finite element method thermal fatigue life |
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