| 一种叠层片式大电流磁珠的设计研究 |
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| 引用本文： | 樊应县,高永毅,许杨生,丁晓鸿,杨邦朝. 一种叠层片式大电流磁珠的设计研究[J]. 电子元件与材料, 2011, 30(6): 58-61 |
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| 作者姓名： | 樊应县 高永毅 许杨生 丁晓鸿 杨邦朝 |
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| 作者单位： | 深圳振华富电子有限公司;电子科技大学微电子与固体学院; |
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| 基金项目： | 贵州省火炬计划资助项目(No.黔科合G字(2006)5007) |
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| 摘 要： | 叠层片式大电流磁珠是为了适应电子设备尤其是电源部分电磁兼容的需要而提出研制的.它具有:尺寸小、质量轻、耐电流高、磁路闭合、抗电磁干扰能力强;独石结构、便于元件的高密度表面贴装生产等优点.主要介绍了一种叠层片式大电流磁珠的材料和结构设计的研究工作.并研制出了一种耐电流9 A的4532型叠层片式大电流磁珠.
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| 关 键 词： | 叠层片式磁珠 大电流 设计 |
Design and research for multilayer large current chip beads |
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| FAN Yingxian,GAO Yongyi,XU Yangsheng,DING Xiaohong,YANG Bangchao. Design and research for multilayer large current chip beads[J]. Electronic Components & Materials, 2011, 30(6): 58-61 |
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| Authors: | FAN Yingxian GAO Yongyi XU Yangsheng DING Xiaohong YANG Bangchao |
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| Affiliation: | FAN Yingxian1,GAO Yongyi1,XU Yangsheng1,DING Xiaohong1,YANG Bangchao2(1.Shenzhen Zhenhua Ferrite&Ceramic Electronics Co.,Ltd,Shenzhen 518109,Guangdong Province,China,2.School of Microelectronic and Solid-State Electronics,University of Electronic Science and Technology of China,Chengdu 610054,China) |
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| Abstract: | Multilayer large current chip beads are studied for application of electronic devices,especially for EMC(electromagnetic compatibility) of power supply.The advantages of this chip beads possess small size,light weight and high current capability,closed magnetic path,high EMI(Electro-Magnetic Interference) immunity and so on.They are suited for high density SMT(Surface Mounting Technology) production of components with multilayer ceramic structure.The research of materials and structure design of a multilaye... |
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| Keywords: | multilayer chip beads large current design |
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