| 激光在MEMS键合技术中的应用 |
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| 引用本文： | 杨道虹,董典红,徐晨,张剑铭,阳启明,沈光地.激光在MEMS键合技术中的应用[J].半导体光电,2004,25(2):143-146. |
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| 作者姓名： | 杨道虹 董典红 徐晨 张剑铭 阳启明 沈光地 |
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| 作者单位： | 北京工业大学,电信学院,北京,100022;北京工业大学,电信学院,北京,100022;北京工业大学,电信学院,北京,100022;北京工业大学,电信学院,北京,100022;北京工业大学,电信学院,北京,100022;北京工业大学,电信学院,北京,100022 |
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| 摘 要： | 键合技术已经广泛地应用于微电子机械系统(MEMS)领域,但传统的键合技术由于其缺点,限制了其应用范围,而激光以其独特的优势在键合技术中得到了人们的重视.文章介绍了激光在键合技术中的应用及其原理,以及今后发展的方向.
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| 关 键 词： | 微电子机械系统 硅直接键合 激光 |
| 文章编号： | 1001-5868(2004)02-0143-04 |
| 修稿时间： | 2003年9月4日 |
Laser Applications in Bonding of MEMS |
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| YANG Dao-hong,DONG Dian-hong,XU Chen,ZHANG Jian-ming,YANG Qi-ming,SHEN Guang-di College of Electronic Information,Beijing University of Technology,BeiJing ,CHN.Laser Applications in Bonding of MEMS[J].Semiconductor Optoelectronics,2004,25(2):143-146. |
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| Authors: | YANG Dao-hong DONG Dian-hong XU Chen ZHANG Jian-ming YANG Qi-ming SHEN Guang-di College of Electronic Information Beijing University of Technology BeiJing CHN |
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| Affiliation: | YANG Dao-hong,DONG Dian-hong,XU Chen,ZHANG Jian-ming,YANG Qi-ming,SHEN Guang-di College of Electronic Information,Beijing University of Technology,BeiJing 100022,CHN |
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| Abstract: | The bonding technology is widely used in the fields of MEMS, and its application
is limited due to some disadvantages in traditional bonding method of MEMS. Laser unique
performances are received great attention in bonding technology. Laser application, principle and
future developmental direction in bonding of MEMS are presented. |
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| Keywords: | MEMS silicon directly bonding laser |
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